Application of total productive maintenance to reduce non-stick on pad problem in IC packaging.
Focus improvement activity was employed to improve front-end assembly yield in integrated circuit packaging. The top three yield losses in parts per million (ppm) in front-end assembly were contributed by the following defects: non-stick on pad (NSOP) (2715 ppm), chip and crack (782 ppm) and missing...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English English |
| Published: |
2012
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| Online Access: | http://psasir.upm.edu.my/id/eprint/23441/1/Application%20of%20total%20productive%20maintenance%20to%20reduce%20non.pdf |