Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode with and without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles. The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycl...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Electrochemical Science Group
2011
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| Online Access: | http://psasir.upm.edu.my/id/eprint/24904/1/Surface%20morphology%20and%20electrical%20properties%20of%20pulse%20electrodeposition%20of%20NiFe%20films%20on%20copper%20substrates%20in%20ultrasonic%20field.pdf |