Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders
The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetall...
| Principais autores: | , , , |
|---|---|
| Formato: | Artigo |
| Idioma: | English |
| Publicado em: |
Trans Tech Publications
2013
|
| Acesso em linha: | http://psasir.upm.edu.my/id/eprint/28721/1/Effect%20of%20isothermal%20aging%202000%20hours%20on%20intermetallics%20formed%20between%20Ni.pdf |