Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review
Owing to the great advancement in technology, the input/output terminals in electronic packaging have greatly increased resulting to a proportional increase in solder interconnection joints of electrical components. Therefore, in order to work in line with the mission and vision of the electronic in...
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| Formato: | Artigo |
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American-Eurasian Network for Scientific Information
2014
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