Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review
Owing to the great advancement in technology, the input/output terminals in electronic packaging have greatly increased resulting to a proportional increase in solder interconnection joints of electrical components. Therefore, in order to work in line with the mission and vision of the electronic in...
Principais autores: | Dele-Afolabi, T. T., Mohamed Ariff, Azmah Hanim, Mazlan, Norkhairunnisa, Mohamed Yusoff, Hamdan |
---|---|
Formato: | Artigo |
Publicado em: |
American-Eurasian Network for Scientific Information
2014
|
Registros relacionados
-
Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint
por: Theophilus, Dele-Afolabi Temitope, et al.
Publicado em: (2015) -
Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
por: Dele-Afolabi, Temitope Theophilus
Publicado em: (2015) -
Performance assessment of Sn-based lead-free solder composite joints based on extreme learning machine model tuned by Aquila optimizer
por: Temitope T., Dele-Afolabi, et al.
Publicado em: (2024) -
Shear analysis of rice husk ash RHA reinforced tin- 0.7-copper composite solders on electroless nickel/immersion silver ENIAg surfaces
por: Mohamed Ariff, Azmah Hanim, et al.
Publicado em: (2021) -
Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn-5Sb solder composites on Cu substrate
por: T. Temitope, Dele Afolabi, et al.
Publicado em: (2019)