Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review
Owing to the great advancement in technology, the input/output terminals in electronic packaging have greatly increased resulting to a proportional increase in solder interconnection joints of electrical components. Therefore, in order to work in line with the mission and vision of the electronic in...
Main Authors: | Dele-Afolabi, T. T., Mohamed Ariff, Azmah Hanim, Mazlan, Norkhairunnisa, Mohamed Yusoff, Hamdan |
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Format: | Article |
Published: |
American-Eurasian Network for Scientific Information
2014
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