Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review

Owing to the great advancement in technology, the input/output terminals in electronic packaging have greatly increased resulting to a proportional increase in solder interconnection joints of electrical components. Therefore, in order to work in line with the mission and vision of the electronic in...

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Detalhes bibliográficos
Principais autores: Dele-Afolabi, T. T., Mohamed Ariff, Azmah Hanim, Mazlan, Norkhairunnisa, Mohamed Yusoff, Hamdan
Formato: Artigo
Publicado em: American-Eurasian Network for Scientific Information 2014

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