Metallization process for alumina substrates
Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating subs...
| Main Authors: | , , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
Universiti Putra Malaysia Press
2005
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| Online Access: | http://psasir.upm.edu.my/id/eprint/38675/1/38675.pdf |
| _version_ | 1825949269522120704 |
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| author | Mohd Shapee, Sabrina Alias, Rosidah Ibrahim, Azmi Yahya, Mohamed Razman Awang Mat, Abdul Fatah Hashim, Mansor |
| author_facet | Mohd Shapee, Sabrina Alias, Rosidah Ibrahim, Azmi Yahya, Mohamed Razman Awang Mat, Abdul Fatah Hashim, Mansor |
| author_sort | Mohd Shapee, Sabrina |
| collection | UPM |
| description | Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating substrate like alumina substrates. Three fundamental methods of metallizing alumina substrates include thick film, thin film and copper metallization technology. In this paper, the RF magnetron sputtering method was used to deposit copper conductor on alumina substrate surface. |
| first_indexed | 2024-03-06T08:41:58Z |
| format | Conference or Workshop Item |
| id | upm.eprints-38675 |
| institution | Universiti Putra Malaysia |
| language | English |
| last_indexed | 2024-03-06T08:41:58Z |
| publishDate | 2005 |
| publisher | Universiti Putra Malaysia Press |
| record_format | dspace |
| spelling | upm.eprints-386752018-09-25T01:29:40Z http://psasir.upm.edu.my/id/eprint/38675/ Metallization process for alumina substrates Mohd Shapee, Sabrina Alias, Rosidah Ibrahim, Azmi Yahya, Mohamed Razman Awang Mat, Abdul Fatah Hashim, Mansor Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating substrate like alumina substrates. Three fundamental methods of metallizing alumina substrates include thick film, thin film and copper metallization technology. In this paper, the RF magnetron sputtering method was used to deposit copper conductor on alumina substrate surface. Universiti Putra Malaysia Press 2005 Conference or Workshop Item NonPeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/38675/1/38675.pdf Mohd Shapee, Sabrina and Alias, Rosidah and Ibrahim, Azmi and Yahya, Mohamed Razman and Awang Mat, Abdul Fatah and Hashim, Mansor (2005) Metallization process for alumina substrates. In: International Advanced Technology Congress: Conference on Advanced Materials (CAM 2005), 6-8 Dec. 2005, Putrajaya, Malaysia. (pp. 181-184). |
| spellingShingle | Mohd Shapee, Sabrina Alias, Rosidah Ibrahim, Azmi Yahya, Mohamed Razman Awang Mat, Abdul Fatah Hashim, Mansor Metallization process for alumina substrates |
| title | Metallization process for alumina substrates |
| title_full | Metallization process for alumina substrates |
| title_fullStr | Metallization process for alumina substrates |
| title_full_unstemmed | Metallization process for alumina substrates |
| title_short | Metallization process for alumina substrates |
| title_sort | metallization process for alumina substrates |
| url | http://psasir.upm.edu.my/id/eprint/38675/1/38675.pdf |
| work_keys_str_mv | AT mohdshapeesabrina metallizationprocessforaluminasubstrates AT aliasrosidah metallizationprocessforaluminasubstrates AT ibrahimazmi metallizationprocessforaluminasubstrates AT yahyamohamedrazman metallizationprocessforaluminasubstrates AT awangmatabdulfatah metallizationprocessforaluminasubstrates AT hashimmansor metallizationprocessforaluminasubstrates |