Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic...
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| Format: | Article |
| Language: | English English |
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Elsevier
2003
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| Online Access: | http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf http://psasir.upm.edu.my/id/eprint/40033/7/1-s2.0-S0032959203000943-main.pdf |
| _version_ | 1811137431630512128 |
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| author | Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas |
| author_facet | Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas |
| author_sort | Wong, K. K. |
| collection | UPM |
| description | The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic solution and wastewater. A series of column studies were carried out. Increase in column bed depth yielded longer service time while increase in influent concentration and flow rate resulted in faster breakthrough. The sorption capacities of the TARH column for Cu and Pb agreed closely with the levels obtained from batch equilibrium studies. Theoretical breakthrough curves at different bed heights and flow rates generated using a two-parameter model agreed closely with experimental values in the treatment of semiconductor wastewater. In the regeneration study, Cu and Pb could be recovered almost quantitatively by eluting the column with 0.1 M HCl and the column could be used repeatedly for at least five cycles. |
| first_indexed | 2024-03-06T08:45:53Z |
| format | Article |
| id | upm.eprints-40033 |
| institution | Universiti Putra Malaysia |
| language | English English |
| last_indexed | 2024-09-25T03:34:12Z |
| publishDate | 2003 |
| publisher | Elsevier |
| record_format | dspace |
| spelling | upm.eprints-400332024-07-19T08:29:51Z http://psasir.upm.edu.my/id/eprint/40033/ Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic solution and wastewater. A series of column studies were carried out. Increase in column bed depth yielded longer service time while increase in influent concentration and flow rate resulted in faster breakthrough. The sorption capacities of the TARH column for Cu and Pb agreed closely with the levels obtained from batch equilibrium studies. Theoretical breakthrough curves at different bed heights and flow rates generated using a two-parameter model agreed closely with experimental values in the treatment of semiconductor wastewater. In the regeneration study, Cu and Pb could be recovered almost quantitatively by eluting the column with 0.1 M HCl and the column could be used repeatedly for at least five cycles. Elsevier 2003-12 Article PeerReviewed text en http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf text en http://psasir.upm.edu.my/id/eprint/40033/7/1-s2.0-S0032959203000943-main.pdf Wong, K. K. and Lee, Chnoong Kheng and Low, Kun She and Haron, Md. Jelas (2003) Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk. Process Biochemistry, 39 (4). pp. 437-445. ISSN 1359-5113; ESSN: 1873-3298 http://www.sciencedirect.com/science/article/pii/S0032959203000943 10.1016/S0032-9592(03)00094-3 |
| spellingShingle | Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk |
| title | Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk |
| title_full | Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk |
| title_fullStr | Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk |
| title_full_unstemmed | Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk |
| title_short | Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk |
| title_sort | removal of cu and pb from electroplating wastewater using tartaric acid modified rice husk |
| url | http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf http://psasir.upm.edu.my/id/eprint/40033/7/1-s2.0-S0032959203000943-main.pdf |
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