Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition
Nickel iron (NiFe) thin films were prepared on the copper substrate by ultrasonic assisted pulse electrodeposition under galvanostatic mode. Careful control of the thin films deposition is essential as the electrical properties of the films could be greatly affected, particularly if low quality film...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2016
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| Online Access: | http://psasir.upm.edu.my/id/eprint/53569/1/Physical%20and%20electrical%20characteristics%20of%20NiFe%20thin%20films%20using%20ultrasonic%20assisted%20pulse%20electrodeposition.pdf |
| _version_ | 1825930876810166272 |
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| author | Kakumani, Asa Deepthi Ruthramurthy, Balachandran Ong, Boon Hoong Tan, Kar Ban Wong, Hin Yong Yow, Ho Kwang Sreekantan, Srimala |
| author_facet | Kakumani, Asa Deepthi Ruthramurthy, Balachandran Ong, Boon Hoong Tan, Kar Ban Wong, Hin Yong Yow, Ho Kwang Sreekantan, Srimala |
| author_sort | Kakumani, Asa Deepthi |
| collection | UPM |
| description | Nickel iron (NiFe) thin films were prepared on the copper substrate by ultrasonic assisted pulse electrodeposition under galvanostatic mode. Careful control of the thin films deposition is essential as the electrical properties of the films could be greatly affected, particularly if low quality films are produced. The preparation of NiFe/Cu thin films was aimed to reduce the grain size of NiFe particles, surface roughness and electrical resistivity of the copper substrates. Various parameters were systematically studied including current magnitude, deposition time and ultrasonic bath temperature. The optimized conditions to obtain NiFe permalloy, which subsequently applied to all investigated samples, were found at a current magnitude of 70 mA deposited for a duration of 2 min under ultrasonic bath temperature of 27 °C. The composition of NiFe permalloy was as close as Ni 80.71% and Fe 19.29% and the surface roughness was reduced from 12.76 nm to 2.25 nm. The films electrical resistivity was decreased nearly sevenfold from an initial value of 67.32 μΩ cm to 9.46 μΩ cm. |
| first_indexed | 2024-03-06T09:18:14Z |
| format | Article |
| id | upm.eprints-53569 |
| institution | Universiti Putra Malaysia |
| language | English |
| last_indexed | 2024-03-06T09:18:14Z |
| publishDate | 2016 |
| publisher | Elsevier |
| record_format | dspace |
| spelling | upm.eprints-535692019-06-13T02:57:49Z http://psasir.upm.edu.my/id/eprint/53569/ Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition Kakumani, Asa Deepthi Ruthramurthy, Balachandran Ong, Boon Hoong Tan, Kar Ban Wong, Hin Yong Yow, Ho Kwang Sreekantan, Srimala Nickel iron (NiFe) thin films were prepared on the copper substrate by ultrasonic assisted pulse electrodeposition under galvanostatic mode. Careful control of the thin films deposition is essential as the electrical properties of the films could be greatly affected, particularly if low quality films are produced. The preparation of NiFe/Cu thin films was aimed to reduce the grain size of NiFe particles, surface roughness and electrical resistivity of the copper substrates. Various parameters were systematically studied including current magnitude, deposition time and ultrasonic bath temperature. The optimized conditions to obtain NiFe permalloy, which subsequently applied to all investigated samples, were found at a current magnitude of 70 mA deposited for a duration of 2 min under ultrasonic bath temperature of 27 °C. The composition of NiFe permalloy was as close as Ni 80.71% and Fe 19.29% and the surface roughness was reduced from 12.76 nm to 2.25 nm. The films electrical resistivity was decreased nearly sevenfold from an initial value of 67.32 μΩ cm to 9.46 μΩ cm. Elsevier 2016-01 Article PeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/53569/1/Physical%20and%20electrical%20characteristics%20of%20NiFe%20thin%20films%20using%20ultrasonic%20assisted%20pulse%20electrodeposition.pdf Kakumani, Asa Deepthi and Ruthramurthy, Balachandran and Ong, Boon Hoong and Tan, Kar Ban and Wong, Hin Yong and Yow, Ho Kwang and Sreekantan, Srimala (2016) Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition. Applied Surface Science, 360 (pt. B). pp. 519-524. ISSN 0169-4332; ESSN: 1873-5584 http://www.sciencedirect.com/science/article/pii/S0169433215026008 10.1016/j.apsusc.2015.10.181 |
| spellingShingle | Kakumani, Asa Deepthi Ruthramurthy, Balachandran Ong, Boon Hoong Tan, Kar Ban Wong, Hin Yong Yow, Ho Kwang Sreekantan, Srimala Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition |
| title | Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition |
| title_full | Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition |
| title_fullStr | Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition |
| title_full_unstemmed | Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition |
| title_short | Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition |
| title_sort | physical and electrical characteristics of nife thin films using ultrasonic assisted pulse electrodeposition |
| url | http://psasir.upm.edu.my/id/eprint/53569/1/Physical%20and%20electrical%20characteristics%20of%20NiFe%20thin%20films%20using%20ultrasonic%20assisted%20pulse%20electrodeposition.pdf |
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