Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 w...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2016
|
| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/54598/1/Interfacial%20reaction%20analysis%20of%20Sn-Ag-Cu%20solder%20reinforced%20with%200.01wt%25%20CNTs%20with%20isothermal%20aging.pdf |
| _version_ | 1796976114421202944 |
|---|---|
| author | Mohamed Ariff, Azmah Hanim M. N., Mohamad Aznan R., Muhammad Raimi A., Muhammad Azrol Amin |
| author_facet | Mohamed Ariff, Azmah Hanim M. N., Mohamad Aznan R., Muhammad Raimi A., Muhammad Azrol Amin |
| author_sort | Mohamed Ariff, Azmah Hanim |
| collection | UPM |
| description | This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7wt.%) reinforced with 0.01 wt.% of Multi-Walled Carbon Nanotubes (MWCNTs) were soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Isothermal aging at 150°C for 400h, 800h, and 1200h were conducted after as reflow process. The IMC layer were analysed using optical microscope with image analyzer. The results shows the thickness of IMC layer for both ENIG and ImSn increased as the isothermal aging period increases. The increament was found from 1.49 μm to 1.73 μm for ENIG and 2.51 μm to 5.49 μm for ImSn. Floating IMC and voids formation were also observed on both pad finishes. Wetting angle for ENIG and ImSn varied from 16.21° to 36.85° and 24.27° to 34.41° respectively. |
| first_indexed | 2024-03-06T09:21:08Z |
| format | Article |
| id | upm.eprints-54598 |
| institution | Universiti Putra Malaysia |
| language | English |
| last_indexed | 2024-03-06T09:21:08Z |
| publishDate | 2016 |
| publisher | Trans Tech Publications |
| record_format | dspace |
| spelling | upm.eprints-545982018-04-03T01:16:49Z http://psasir.upm.edu.my/id/eprint/54598/ Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging Mohamed Ariff, Azmah Hanim M. N., Mohamad Aznan R., Muhammad Raimi A., Muhammad Azrol Amin This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7wt.%) reinforced with 0.01 wt.% of Multi-Walled Carbon Nanotubes (MWCNTs) were soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Isothermal aging at 150°C for 400h, 800h, and 1200h were conducted after as reflow process. The IMC layer were analysed using optical microscope with image analyzer. The results shows the thickness of IMC layer for both ENIG and ImSn increased as the isothermal aging period increases. The increament was found from 1.49 μm to 1.73 μm for ENIG and 2.51 μm to 5.49 μm for ImSn. Floating IMC and voids formation were also observed on both pad finishes. Wetting angle for ENIG and ImSn varied from 16.21° to 36.85° and 24.27° to 34.41° respectively. Trans Tech Publications 2016-08 Article PeerReviewed text en http://psasir.upm.edu.my/id/eprint/54598/1/Interfacial%20reaction%20analysis%20of%20Sn-Ag-Cu%20solder%20reinforced%20with%200.01wt%25%20CNTs%20with%20isothermal%20aging.pdf Mohamed Ariff, Azmah Hanim and M. N., Mohamad Aznan and R., Muhammad Raimi and A., Muhammad Azrol Amin (2016) Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging. Materials Science Forum, 864. pp. 175-179. ISSN 0255-5476; ESSN: 1662-9752 https://www.scientific.net/MSF.864.175 SAC237; Multi-walled carbon nanotubes; ENIG; Immersion tin; As reflow; Isothermal aging; Intermetallic compound 10.4028/www.scientific.net/MSF.864.175 |
| spellingShingle | SAC237; Multi-walled carbon nanotubes; ENIG; Immersion tin; As reflow; Isothermal aging; Intermetallic compound Mohamed Ariff, Azmah Hanim M. N., Mohamad Aznan R., Muhammad Raimi A., Muhammad Azrol Amin Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging |
| title | Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging |
| title_full | Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging |
| title_fullStr | Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging |
| title_full_unstemmed | Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging |
| title_short | Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging |
| title_sort | interfacial reaction analysis of sn ag cu solder reinforced with 0 01wt cnts with isothermal aging |
| topic | SAC237; Multi-walled carbon nanotubes; ENIG; Immersion tin; As reflow; Isothermal aging; Intermetallic compound |
| url | http://psasir.upm.edu.my/id/eprint/54598/1/Interfacial%20reaction%20analysis%20of%20Sn-Ag-Cu%20solder%20reinforced%20with%200.01wt%25%20CNTs%20with%20isothermal%20aging.pdf |
| work_keys_str_mv | AT mohamedariffazmahhanim interfacialreactionanalysisofsnagcusolderreinforcedwith001wtcntswithisothermalaging AT mnmohamadaznan interfacialreactionanalysisofsnagcusolderreinforcedwith001wtcntswithisothermalaging AT rmuhammadraimi interfacialreactionanalysisofsnagcusolderreinforcedwith001wtcntswithisothermalaging AT amuhammadazrolamin interfacialreactionanalysisofsnagcusolderreinforcedwith001wtcntswithisothermalaging |