Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 w...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2016
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| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/54598/1/Interfacial%20reaction%20analysis%20of%20Sn-Ag-Cu%20solder%20reinforced%20with%200.01wt%25%20CNTs%20with%20isothermal%20aging.pdf |