Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint
The effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints with solder formulations (Sn-5Sb-xCNT; 0, 0.01, 0.05 and 0.1 wt.%) was evaluated. The melting temperature results indicate that the presence of carbon nanotubes addition to t...
| Main Authors: | , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
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2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/66183/1/Influence%20of%20multi-walled%20carbon%20nanotubes%20on%20melting%20temperature%20and%20microstructural%20evolution%20of%20Pb-free%20Sn-5SbCu%20solder%20joint.pdf |
| _version_ | 1825933084449570816 |
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| author | Theophilus, Dele-Afolabi Temitope Mohamed Ariff, Azmah Hanim Mazlan, Norkhairunnisa Mohamed Yusoff, Hamdan Mohd Tahir, Suraya |
| author_facet | Theophilus, Dele-Afolabi Temitope Mohamed Ariff, Azmah Hanim Mazlan, Norkhairunnisa Mohamed Yusoff, Hamdan Mohd Tahir, Suraya |
| author_sort | Theophilus, Dele-Afolabi Temitope |
| collection | UPM |
| description | The effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints with solder formulations (Sn-5Sb-xCNT; 0, 0.01, 0.05 and 0.1 wt.%) was evaluated. The melting temperature results indicate that the presence of carbon nanotubes addition to the solder matrix lead to a marginal decrease in the peak temperature of the composite solders due to high surface free energy of MWCNTs in the solder matrix. More so, solder joints were subjected to both the as-reflow and isothermal aging conditions after which the microstructural evolution in the joints was investigated. From the IMC thickness data retrieved, it was observed that the composite solders showed better results for all subjected conditions as compared with the plain solder and the most appreciable IMC layer suppression was detected across board in the 0.05wt.% CNTs reinforced solder system. |
| first_indexed | 2024-03-06T09:51:52Z |
| format | Conference or Workshop Item |
| id | upm.eprints-66183 |
| institution | Universiti Putra Malaysia |
| language | English |
| last_indexed | 2024-03-06T09:51:52Z |
| publishDate | 2015 |
| record_format | dspace |
| spelling | upm.eprints-661832019-02-12T06:46:24Z http://psasir.upm.edu.my/id/eprint/66183/ Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint Theophilus, Dele-Afolabi Temitope Mohamed Ariff, Azmah Hanim Mazlan, Norkhairunnisa Mohamed Yusoff, Hamdan Mohd Tahir, Suraya The effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints with solder formulations (Sn-5Sb-xCNT; 0, 0.01, 0.05 and 0.1 wt.%) was evaluated. The melting temperature results indicate that the presence of carbon nanotubes addition to the solder matrix lead to a marginal decrease in the peak temperature of the composite solders due to high surface free energy of MWCNTs in the solder matrix. More so, solder joints were subjected to both the as-reflow and isothermal aging conditions after which the microstructural evolution in the joints was investigated. From the IMC thickness data retrieved, it was observed that the composite solders showed better results for all subjected conditions as compared with the plain solder and the most appreciable IMC layer suppression was detected across board in the 0.05wt.% CNTs reinforced solder system. 2015 Conference or Workshop Item PeerReviewed text en http://psasir.upm.edu.my/id/eprint/66183/1/Influence%20of%20multi-walled%20carbon%20nanotubes%20on%20melting%20temperature%20and%20microstructural%20evolution%20of%20Pb-free%20Sn-5SbCu%20solder%20joint.pdf Theophilus, Dele-Afolabi Temitope and Mohamed Ariff, Azmah Hanim and Mazlan, Norkhairunnisa and Mohamed Yusoff, Hamdan and Mohd Tahir, Suraya (2015) Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint. In: INTROP Research Colloquim 2015, 1-2 Dec. 2015, RHR Hotel, Uniten, Putrajaya. . |
| spellingShingle | Theophilus, Dele-Afolabi Temitope Mohamed Ariff, Azmah Hanim Mazlan, Norkhairunnisa Mohamed Yusoff, Hamdan Mohd Tahir, Suraya Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint |
| title | Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint |
| title_full | Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint |
| title_fullStr | Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint |
| title_full_unstemmed | Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint |
| title_short | Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint |
| title_sort | influence of multi walled carbon nanotubes on melting temperature and microstructural evolution of pb free sn 5sb cu solder joint |
| url | http://psasir.upm.edu.my/id/eprint/66183/1/Influence%20of%20multi-walled%20carbon%20nanotubes%20on%20melting%20temperature%20and%20microstructural%20evolution%20of%20Pb-free%20Sn-5SbCu%20solder%20joint.pdf |
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