Application of artificial neural network for optimization the wet contact angle for lead free Bi-Ag soldering alloys
In recent years, electronic packaging provides significant research and development challenges across multiple disciplines such as performance, materials, reliability, thermals and interconnections. New technologies and techniques frequently adopted can be implemented in soldering alloys of semicond...
| Main Authors: | , , , , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/66185/1/Application%20of%20artificial%20neural%20network%20for%20optimization%20the%20wet%20contact%20angle%20for%20lead%20free%20Bi-Ag%20soldering%20alloys.pdf |