Interconnect area, delay and area-delay optimization for multi-level signaling on-chip bus
In this paper, the technique of optimal interconnects width and spacing is analyzed to reduce the area, delay and area-delay-product of multi-level signaling on-chip bus. To capture the delay impact from cross-coupling capacitance in the deep sub-micron on-chip bus, the Miller Capacitance Factor (MC...
Main Authors: | , , , |
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Format: | Conference or Workshop Item |
Language: | English |
Published: |
IEEE
2010
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Online Access: | http://psasir.upm.edu.my/id/eprint/68598/1/Interconnect%20area%2C%20delay%20and%20area-delay%20optimization%20for%20multi-level%20signaling%20on-chip%20bus.pdf |
Summary: | In this paper, the technique of optimal interconnects width and spacing is analyzed to reduce the area, delay and area-delay-product of multi-level signaling on-chip bus. To capture the delay impact from cross-coupling capacitance in the deep sub-micron on-chip bus, the Miller Capacitance Factor (MCF) for 4-level signals is developed. Results show that our proposed technique reveals the trade-off between bus area and delay to achieve the optimized bus configuration. |
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