Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field
Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed...
| Main Authors: | , , , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
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IEEE
2008
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| Online Access: | http://psasir.upm.edu.my/id/eprint/69416/1/Surface%20morphology%20of%20Ni-Fe%20thin%20films%20grown%20on%20copper%20substrates%20using%20pulse%20electrodeposition%20in%20ultrasonic%20field.pdf |
| _version_ | 1825933716474560512 |
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| author | Ruthramurthy, Balachandran Yow, Ho Kwang Ong, Boon Hoong Ramasamy, Manickam Kassim, Anuar Teoh, Wah Tzu Tan, Kar Ban |
| author_facet | Ruthramurthy, Balachandran Yow, Ho Kwang Ong, Boon Hoong Ramasamy, Manickam Kassim, Anuar Teoh, Wah Tzu Tan, Kar Ban |
| author_sort | Ruthramurthy, Balachandran |
| collection | UPM |
| description | Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed the deposition of NiFe on Cu substrates and the crystallite size calculated from Scherrerpsilas formula is 22.28 nm and 20.17 nm respectively for the films fabricated in the absence and presence of ultrasonic field. The grain sizes, from SEM micrographs, were found to be 225.52 nm and 79.64 nm respectively for the films fabricated in the absence and presence of ultrasonic field and the grains were in the shape of spherical balls. |
| first_indexed | 2024-03-06T10:01:37Z |
| format | Conference or Workshop Item |
| id | upm.eprints-69416 |
| institution | Universiti Putra Malaysia |
| language | English |
| last_indexed | 2024-03-06T10:01:37Z |
| publishDate | 2008 |
| publisher | IEEE |
| record_format | dspace |
| spelling | upm.eprints-694162019-07-04T04:15:59Z http://psasir.upm.edu.my/id/eprint/69416/ Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field Ruthramurthy, Balachandran Yow, Ho Kwang Ong, Boon Hoong Ramasamy, Manickam Kassim, Anuar Teoh, Wah Tzu Tan, Kar Ban Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed the deposition of NiFe on Cu substrates and the crystallite size calculated from Scherrerpsilas formula is 22.28 nm and 20.17 nm respectively for the films fabricated in the absence and presence of ultrasonic field. The grain sizes, from SEM micrographs, were found to be 225.52 nm and 79.64 nm respectively for the films fabricated in the absence and presence of ultrasonic field and the grains were in the shape of spherical balls. IEEE 2008 Conference or Workshop Item PeerReviewed text en http://psasir.upm.edu.my/id/eprint/69416/1/Surface%20morphology%20of%20Ni-Fe%20thin%20films%20grown%20on%20copper%20substrates%20using%20pulse%20electrodeposition%20in%20ultrasonic%20field.pdf Ruthramurthy, Balachandran and Yow, Ho Kwang and Ong, Boon Hoong and Ramasamy, Manickam and Kassim, Anuar and Teoh, Wah Tzu and Tan, Kar Ban (2008) Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field. In: 2008 IEEE International Conference on Semiconductor Electronics (ICSE 2008), 25-27 Nov. 2008, Johor Bahru, Malaysia. (pp. 491-494). 10.1109/SMELEC.2008.4770371 |
| spellingShingle | Ruthramurthy, Balachandran Yow, Ho Kwang Ong, Boon Hoong Ramasamy, Manickam Kassim, Anuar Teoh, Wah Tzu Tan, Kar Ban Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_full | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_fullStr | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_full_unstemmed | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_short | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_sort | surface morphology of ni fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| url | http://psasir.upm.edu.my/id/eprint/69416/1/Surface%20morphology%20of%20Ni-Fe%20thin%20films%20grown%20on%20copper%20substrates%20using%20pulse%20electrodeposition%20in%20ultrasonic%20field.pdf |
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