Drop impact testing for Pb-freee aloy on IC packaging
Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in...
| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
Faculty of Computer Science and Information Technology, Universiti Putra Malaysia
2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf |
| _version_ | 1825950806131605504 |
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| author | Ismail, Noor Faezah Sulaiman, Nasri Md Yunus, Nurul Amziah |
| author_facet | Ismail, Noor Faezah Sulaiman, Nasri Md Yunus, Nurul Amziah |
| author_sort | Ismail, Noor Faezah |
| collection | UPM |
| description | Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in a proper way so that it will produce a good interconnection while a bad interconnection can cause a weak adhesion, which lead to bad results and minimize the lifetime of the devices. The heavy the weight of object, the stronger impact force will be experienced. |
| first_indexed | 2024-03-06T10:20:15Z |
| format | Conference or Workshop Item |
| id | upm.eprints-77196 |
| institution | Universiti Putra Malaysia |
| language | English |
| last_indexed | 2024-03-06T10:20:15Z |
| publishDate | 2015 |
| publisher | Faculty of Computer Science and Information Technology, Universiti Putra Malaysia |
| record_format | dspace |
| spelling | upm.eprints-771962020-03-04T06:57:35Z http://psasir.upm.edu.my/id/eprint/77196/ Drop impact testing for Pb-freee aloy on IC packaging Ismail, Noor Faezah Sulaiman, Nasri Md Yunus, Nurul Amziah Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in a proper way so that it will produce a good interconnection while a bad interconnection can cause a weak adhesion, which lead to bad results and minimize the lifetime of the devices. The heavy the weight of object, the stronger impact force will be experienced. Faculty of Computer Science and Information Technology, Universiti Putra Malaysia 2015 Conference or Workshop Item PeerReviewed text en http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf Ismail, Noor Faezah and Sulaiman, Nasri and Md Yunus, Nurul Amziah (2015) Drop impact testing for Pb-freee aloy on IC packaging. In: 3rd International Symposium on Applied Engineering and Sciences (SAES2015), 23-24 Nov. 2015, Universiti Putra Malaysia. (pp. 288-290). |
| spellingShingle | Ismail, Noor Faezah Sulaiman, Nasri Md Yunus, Nurul Amziah Drop impact testing for Pb-freee aloy on IC packaging |
| title | Drop impact testing for Pb-freee aloy on IC packaging |
| title_full | Drop impact testing for Pb-freee aloy on IC packaging |
| title_fullStr | Drop impact testing for Pb-freee aloy on IC packaging |
| title_full_unstemmed | Drop impact testing for Pb-freee aloy on IC packaging |
| title_short | Drop impact testing for Pb-freee aloy on IC packaging |
| title_sort | drop impact testing for pb freee aloy on ic packaging |
| url | http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf |
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