Stress Intensity factor for cracks problems in bonded dissimilar materials

Stress Intensity factor for cracks problems in bonded dissimilar materials

The inclined crack problem in bonded dissimilar materials was considered in this study. The system of hypersingular integral equations (HSIEs) was formulated using the modified complex potentials (MCP) function method, where the continuity conditions of the resultant force and the displacement are a...

Full description

Bibliographic Details
Main Authors:	Hamzah, Khairum, Nik Long, Nik Mohd Asri, Senu, Norazak, Eshkuvatov, Zainidin K.
Format:	Article
Published:	Institut Teknologi Bandung * Lembaga Penelitian dan Pengabdian kepada Masyarakat 2020

Similar Items

Stress intensity factors for a crack in bonded dissimilar materials subjected to various stresses
by: Hamzah, Khairum, et al.
Published: (2019)

Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings
by: Hamzah, Khairum, et al.
Published: (2021)

A new system of singular integral equations for a curvilinear crack in bonded materials
by: Hamzah, Khairum, et al.
Published: (2021)

Stress intensity factor for bonded dissimilar materials weakened by multiple cracks
by: Hamzah, K., et al.
Published: (2020)

Stress intensity factor for a thermally insulated crack in bonded dissimilar materials
by: Hamzah, K. B., et al.
Published: (2019)

Solving crack problems in bonded dissimilar materials using hypersingular integral equations
by: Hamzah, Khairum
Published: (2019)

Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations
by: Hamzah, K. B., et al.
Published: (2021)

Singular integral equation for an edge crack originates at the interface of two bonded half-planes
by: Husin, Nur Hazirah, et al.
Published: (2024)

Stress intensity factor for the interaction between a straight crack and a curved crack in plane elasticity
by: Aridi, M. R., et al.
Published: (2016)

Stress intensity factor for multiple cracks in half plane elasticity
by: Elfakhakhre, Nawara R. F., et al.
Published: (2016)

Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack
by: Mohd Nordin, Muhammad Haziq Iqmal, et al.
Published: (2024)

Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
by: Hamzah, K. B., et al.
Published: (2020)

Mode stresses for the interaction between two inclined cracks in bonded two half planes
by: Hamzah, Khairum, et al.
Published: (2020)

Numerical solution for circular arc cracks in half plane elasticity
by: Elfakhakhre, Nawara Rajab Fathullah, et al.
Published: (2019)

Mode stresses for the interaction between straight and curved cracks problem in plane elasticity
by: Aridi, Mohd Radzi, et al.
Published: (2014)

Stress intensity factors of edge cracks in dissimilar joint plates
by: Nik Ismail, Nik Ainun
Published: (2014)

Mode stresses for the interaction between an inclined crack and curved crack in plane elasticity
by: Nik Long, Nik Mohd Asri, et al.
Published: (2014)

Formulation for multiple curved crack problem in a finite plate
by: Ghorbanpoor, R., et al.
Published: (2016)

Formulation for multiple curved and kinked cracks problems in antiplane elasticity
by: Aridi, Mohd Radzi, et al.
Published: (2013)

Interaction between inclined and curved cracks problem in plane elasticity
by: Aridi, Mohd Radzi, et al.
Published: (2013)

Mutiple curved crack problems in antiplane elasticity for circular region with traction free boundary
by: Dahalan, Noraini, et al.
Published: (2013)

Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations
by: Mohd Nordin, Muhammad Haziq Iqmal, et al.
Published: (2023)

Stress intensity factor for an elastic half plane weakend by multiple curved cracks
by: Elfakhakhre, Nawara Rajab Fathullah, et al.
Published: (2018)

Hypersingular integral equation for triple inclined cracks problems in half plane elasticity
by: Husin, Nur Hazirah, et al.
Published: (2019)

Antiplane shear mode stress intensity factor for a slightly perturbed circular crack subject to shear load
by: Nik Long, Nik Mohd Asri, et al.
Published: (2011)

Numerical solutions for cracks in an elastic half plane
by: Elfakhakhre, Nawara Rajab Fathullah, et al.
Published: (2019)

Half circle position for arc cracks in half plane
by: Elfakhakhre, Nawara R. F., et al.
Published: (2018)

Straight cracks in circular positions in plane elasticity
by: Rafar, R. A., et al.
Published: (2016)

Numerical solution for an epicycloid crack
by: Nik Long, Nik Mohd Asri, et al.
Published: (2014)

Hypersingular integral equation for multiple curved cracks problem in plane elasticity.
by: Nik Long, Nik Mohd Asri, et al.
Published: (2009)

Numerical solution for an almost square crack
by: Koo, Lee Feng, et al.
Published: (2014)

Hypersingular integral equation for triple circular arc cracks in an elastic half-plane
by: Husin, Nur Hazirah, et al.
Published: (2021)

Stress analysis in a half plane elasticity
by: Nik Long, Nik Mohd Asri, et al.
Published: (2009)

Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings
by: Mohd Nordin, Muhammad Haziq Iqmal, et al.
Published: (2024)

Stress intensity factor for multiple inclined or curved cracks problem in circular positions in plane elasticity
by: Rafar, R. A., et al.
Published: (2017)

Singular Integral Equation for Curved Cracks
by: Nik Long, Nik Mohd Asri, et al.
Published: (2008)

Quadrature formulafor the complete solution of characteristic singular integral equation on the interval
by: Eshkuvatov, Zainidin K., et al.
Published: (2009)

A quadrature formula for the approximation of Cauchy type singular integrals on the interval
by: Eshkuvatov, Zainidin K., et al.
Published: (2007)

Numerical solution of 1D and 2D thermoelastic coupled problems.
by: Khaldjigitov, Abduvali, et al.
Published: (2012)

Stress intensity factor for multiple cracks in an inﬁnite plate using hypersingular integral equations
by: Ghorbanpoor, Razieh, et al.
Published: (2020)