Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is...
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Springer Wien
2020
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author | Hamzah, K. B. Nik Long, N. M. A. Senu, N. Eshkuvatov, Z. K. |
author_facet | Hamzah, K. B. Nik Long, N. M. A. Senu, N. Eshkuvatov, Z. K. |
author_sort | Hamzah, K. B. |
collection | UPM |
description | The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is used to develop the new system of hypersingular integral equations (HSIEs) for the problems. The new system of HSIEs is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right-hand term using the appropriate quadrature formulas. Numerical results for the nondimensional stress intensity factors (SIFs) at all cracks tips are presented. A comparison between the nondimensional SIFs for cracks with and without thermal influence is also given. |
first_indexed | 2024-03-06T10:41:34Z |
format | Article |
id | upm.eprints-85934 |
institution | Universiti Putra Malaysia |
last_indexed | 2024-03-06T10:41:34Z |
publishDate | 2020 |
publisher | Springer Wien |
record_format | dspace |
spelling | upm.eprints-859342023-10-04T04:40:34Z http://psasir.upm.edu.my/id/eprint/85934/ Stress intensity factors for bonded two half planes weakened by thermally insulated cracks Hamzah, K. B. Nik Long, N. M. A. Senu, N. Eshkuvatov, Z. K. The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is used to develop the new system of hypersingular integral equations (HSIEs) for the problems. The new system of HSIEs is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right-hand term using the appropriate quadrature formulas. Numerical results for the nondimensional stress intensity factors (SIFs) at all cracks tips are presented. A comparison between the nondimensional SIFs for cracks with and without thermal influence is also given. Springer Wien 2020 Article PeerReviewed Hamzah, K. B. and Nik Long, N. M. A. and Senu, N. and Eshkuvatov, Z. K. (2020) Stress intensity factors for bonded two half planes weakened by thermally insulated cracks. Acta Mechanica, 231 (10). 4157 - 4183. ISSN 0001-5970 https://link.springer.com/article/10.1007/s00707-020-02753-0 10.1007/s00707-020-02753-0 |
spellingShingle | Hamzah, K. B. Nik Long, N. M. A. Senu, N. Eshkuvatov, Z. K. Stress intensity factors for bonded two half planes weakened by thermally insulated cracks |
title | Stress intensity factors for bonded two half planes weakened by thermally insulated cracks |
title_full | Stress intensity factors for bonded two half planes weakened by thermally insulated cracks |
title_fullStr | Stress intensity factors for bonded two half planes weakened by thermally insulated cracks |
title_full_unstemmed | Stress intensity factors for bonded two half planes weakened by thermally insulated cracks |
title_short | Stress intensity factors for bonded two half planes weakened by thermally insulated cracks |
title_sort | stress intensity factors for bonded two half planes weakened by thermally insulated cracks |
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