Stress intensity factors for bonded two half planes weakened by thermally insulated cracks

The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is...

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Main Authors: Hamzah, K. B., Nik Long, N. M. A., Senu, N., Eshkuvatov, Z. K.
Format: Article
Published: Springer Wien 2020
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author Hamzah, K. B.
Nik Long, N. M. A.
Senu, N.
Eshkuvatov, Z. K.
author_facet Hamzah, K. B.
Nik Long, N. M. A.
Senu, N.
Eshkuvatov, Z. K.
author_sort Hamzah, K. B.
collection UPM
description The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is used to develop the new system of hypersingular integral equations (HSIEs) for the problems. The new system of HSIEs is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right-hand term using the appropriate quadrature formulas. Numerical results for the nondimensional stress intensity factors (SIFs) at all cracks tips are presented. A comparison between the nondimensional SIFs for cracks with and without thermal influence is also given.
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institution Universiti Putra Malaysia
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spelling upm.eprints-859342023-10-04T04:40:34Z http://psasir.upm.edu.my/id/eprint/85934/ Stress intensity factors for bonded two half planes weakened by thermally insulated cracks Hamzah, K. B. Nik Long, N. M. A. Senu, N. Eshkuvatov, Z. K. The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is used to develop the new system of hypersingular integral equations (HSIEs) for the problems. The new system of HSIEs is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right-hand term using the appropriate quadrature formulas. Numerical results for the nondimensional stress intensity factors (SIFs) at all cracks tips are presented. A comparison between the nondimensional SIFs for cracks with and without thermal influence is also given. Springer Wien 2020 Article PeerReviewed Hamzah, K. B. and Nik Long, N. M. A. and Senu, N. and Eshkuvatov, Z. K. (2020) Stress intensity factors for bonded two half planes weakened by thermally insulated cracks. Acta Mechanica, 231 (10). 4157 - 4183. ISSN 0001-5970 https://link.springer.com/article/10.1007/s00707-020-02753-0 10.1007/s00707-020-02753-0
spellingShingle Hamzah, K. B.
Nik Long, N. M. A.
Senu, N.
Eshkuvatov, Z. K.
Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
title Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
title_full Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
title_fullStr Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
title_full_unstemmed Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
title_short Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
title_sort stress intensity factors for bonded two half planes weakened by thermally insulated cracks
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