Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
In this study, the joint effect of rice husk ash (RHA) reinforcement as an alternative silica source and electroless nickel immersion silver (ENIAg) surface finish on the intermetallic compound (IMC) formation and shear strength of the Sn–0.7Cu solder system was investigated. A series of plain and c...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Springer Nature
2020
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| Online Access: | http://psasir.upm.edu.my/id/eprint/86757/1/Microstructural%20and%20shear%20strength%20properties%20of%20RHA.pdf |