Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.

In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.

Bibliographic Details
Main Authors: Samad, Rosdiyana, Arshad, Mohd Rizal, Samad, Zahurin
Format: Conference or Workshop Item
Language:English
Published: 2005
Subjects:
Online Access:http://eprints.usm.my/14359/1/design.pdf
_version_ 1825829424434511872
author Samad, Rosdiyana
Arshad, Mohd Rizal
Samad, Zahurin
author_facet Samad, Rosdiyana
Arshad, Mohd Rizal
Samad, Zahurin
author_sort Samad, Rosdiyana
collection USM
description In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.
first_indexed 2024-03-06T14:08:24Z
format Conference or Workshop Item
id usm.eprints-14359
institution Universiti Sains Malaysia
language English
last_indexed 2024-03-06T14:08:24Z
publishDate 2005
record_format dspace
spelling usm.eprints-143592017-11-20T07:22:09Z http://eprints.usm.my/14359/ Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. Samad, Rosdiyana Arshad, Mohd Rizal Samad, Zahurin TK1-9971 Electrical engineering. Electronics. Nuclear engineering In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package. 2005 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.usm.my/14359/1/design.pdf Samad, Rosdiyana and Arshad, Mohd Rizal and Samad, Zahurin (2005) Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. In: Proceedings of the 9th WSEAS International CSCC Multiconference : Circuits ’05, System ’05, Computer ’05, Communication ‘05, , 11-16 July 2005 , Vouliagmeni, Athens, Greece.
spellingShingle TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Samad, Rosdiyana
Arshad, Mohd Rizal
Samad, Zahurin
Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_full Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_fullStr Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_full_unstemmed Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_short Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_sort design of crack detection system software for ic package using blob analysis and neural network
topic TK1-9971 Electrical engineering. Electronics. Nuclear engineering
url http://eprints.usm.my/14359/1/design.pdf
work_keys_str_mv AT samadrosdiyana designofcrackdetectionsystemsoftwareforicpackageusingblobanalysisandneuralnetwork
AT arshadmohdrizal designofcrackdetectionsystemsoftwareforicpackageusingblobanalysisandneuralnetwork
AT samadzahurin designofcrackdetectionsystemsoftwareforicpackageusingblobanalysisandneuralnetwork