Heat Pipes In Electronic Packaging

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

Bibliographic Details
Main Author: Munusamy, Sri Jaiandran
Format: Thesis
Language:English
Published: 2006
Subjects:
Online Access:http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
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author Munusamy, Sri Jaiandran
author_facet Munusamy, Sri Jaiandran
author_sort Munusamy, Sri Jaiandran
collection USM
description Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
first_indexed 2024-03-06T14:49:15Z
format Thesis
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institution Universiti Sains Malaysia
language English
last_indexed 2024-03-06T14:49:15Z
publishDate 2006
record_format dspace
spelling usm.eprints-293222017-03-22T02:23:55Z http://eprints.usm.my/29322/ Heat Pipes In Electronic Packaging Munusamy, Sri Jaiandran Q Science Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. 2006-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging. Masters thesis, USM .
spellingShingle Q Science
Munusamy, Sri Jaiandran
Heat Pipes In Electronic Packaging
title Heat Pipes In Electronic Packaging
title_full Heat Pipes In Electronic Packaging
title_fullStr Heat Pipes In Electronic Packaging
title_full_unstemmed Heat Pipes In Electronic Packaging
title_short Heat Pipes In Electronic Packaging
title_sort heat pipes in electronic packaging
topic Q Science
url http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
work_keys_str_mv AT munusamysrijaiandran heatpipesinelectronicpackaging