Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection.
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| Format: | Thesis |
| Language: | English |
| Published: |
2007
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| Online Access: | http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf |
| _version_ | 1825832211554762752 |
|---|---|
| author | Mayappan, Ramani |
| author_facet | Mayappan, Ramani |
| author_sort | Mayappan, Ramani |
| collection | USM |
| description | Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung.
Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. |
| first_indexed | 2024-03-06T14:49:28Z |
| format | Thesis |
| id | usm.eprints-29392 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2024-03-06T14:49:28Z |
| publishDate | 2007 |
| record_format | dspace |
| spelling | usm.eprints-293922017-03-22T02:23:49Z http://eprints.usm.my/29392/ Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization Mayappan, Ramani Q Science Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. 2007-09 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf Mayappan, Ramani (2007) Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization. PhD thesis, USM. |
| spellingShingle | Q Science Mayappan, Ramani Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization |
| title | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization |
| title_full | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization |
| title_fullStr | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization |
| title_full_unstemmed | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization |
| title_short | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization |
| title_sort | study on the wetting properties interfacial reactions and mechanical properties of sn zn and sn zn bi solders on copper metallization |
| topic | Q Science |
| url | http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf |
| work_keys_str_mv | AT mayappanramani studyonthewettingpropertiesinterfacialreactionsandmechanicalpropertiesofsnznandsnznbisoldersoncoppermetallization |