Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Publishing Corporation
2014
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| Subjects: | |
| Online Access: | http://eprints.usm.my/38922/1/Effects_of_Solder_Temperature_on_Pin_Through-Hole_during_Wave_Soldering_Thermal-Fluid.pdf |
| Summary: | An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder
temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the
displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole
connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS
solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183∘C) < |
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