Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises...
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| Format: | Article |
| Language: | English |
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Hindawi Publishing Corporation
2014
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| Online Access: | http://eprints.usm.my/38922/1/Effects_of_Solder_Temperature_on_Pin_Through-Hole_during_Wave_Soldering_Thermal-Fluid.pdf |
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| author | Abdul Aziz, M. S. Abdullah, M. Z. Khor, C. Y. |
| author_facet | Abdul Aziz, M. S. Abdullah, M. Z. Khor, C. Y. |
| author_sort | Abdul Aziz, M. S. |
| collection | USM |
| description | An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder
temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the
displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole
connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS
solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183∘C) < |
| first_indexed | 2024-03-06T15:15:26Z |
| format | Article |
| id | usm.eprints-38922 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2024-03-06T15:15:26Z |
| publishDate | 2014 |
| publisher | Hindawi Publishing Corporation |
| record_format | dspace |
| spelling | usm.eprints-389222018-02-14T04:14:49Z http://eprints.usm.my/38922/ Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis Abdul Aziz, M. S. Abdullah, M. Z. Khor, C. Y. TJ1-1570 Mechanical engineering and machinery An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183∘C) < Hindawi Publishing Corporation 2014 Article PeerReviewed application/pdf en http://eprints.usm.my/38922/1/Effects_of_Solder_Temperature_on_Pin_Through-Hole_during_Wave_Soldering_Thermal-Fluid.pdf Abdul Aziz, M. S. and Abdullah, M. Z. and Khor, C. Y. (2014) Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis. Scientific World Journal, 2014 (482363). pp. 1-13. ISSN 2356-6140 http://dx.doi.org/10.1155/2014/482363 |
| spellingShingle | TJ1-1570 Mechanical engineering and machinery Abdul Aziz, M. S. Abdullah, M. Z. Khor, C. Y. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis |
| title | Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis |
| title_full | Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis |
| title_fullStr | Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis |
| title_full_unstemmed | Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis |
| title_short | Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis |
| title_sort | effects of solder temperature on pin through hole during wave soldering thermal fluid structure interaction analysis |
| topic | TJ1-1570 Mechanical engineering and machinery |
| url | http://eprints.usm.my/38922/1/Effects_of_Solder_Temperature_on_Pin_Through-Hole_during_Wave_Soldering_Thermal-Fluid.pdf |
| work_keys_str_mv | AT abdulazizms effectsofsoldertemperatureonpinthroughholeduringwavesolderingthermalfluidstructureinteractionanalysis AT abdullahmz effectsofsoldertemperatureonpinthroughholeduringwavesolderingthermalfluidstructureinteractionanalysis AT khorcy effectsofsoldertemperatureonpinthroughholeduringwavesolderingthermalfluidstructureinteractionanalysis |