APA (7th ed.) Citation

Chellvarajoo, S. (2016). Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process.

Chicago Style (17th ed.) Citation

Chellvarajoo, Srivalli. Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process. 2016.

MLA (9th ed.) Citation

Chellvarajoo, Srivalli. Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process. 2016.

Warning: These citations may not always be 100% accurate.