Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions

Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions

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96.5Sn-3.0Ag-0.5Cu (SAC305) thin film solder exhibits different surface characteristics if compared to conventional bulk solder. In thin film solder, the actual surface is comprised of intermetallic layers whereas in the case of conventional solder, the intermetallic layers happened at the interfac...

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Bibliographic Details
Main Author:	Lee , Liu Mei
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TA404 Composite materials
Online Access:	http://eprints.usm.my/41122/1/LEE_LIU_MEI__24_Pages.pdf

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