Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
An Ag-Al nanopaste for high temperature die attach applications on SiC power devices has been developed. The Ag-Al nanopaste was studied by varying the Al weight percent in the Ag matrix as well as the organic additives content. The Ag-Al nanopaste was sintered in open air at 380°C for 30 minutes to...
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| Format: | Thesis |
| Language: | English |
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2012
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| Online Access: | http://eprints.usm.my/41148/1/VEMAL_RAJA_MANIKAM_24_Pages.pdf |