Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views

Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the...

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Main Author: Ong , Teng Yeow
Format: Thesis
Language:English
Published: 2010
Subjects:
Online Access:http://eprints.usm.my/42392/1/Ong_Teng_Yeow24.pdf
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author Ong , Teng Yeow
author_facet Ong , Teng Yeow
author_sort Ong , Teng Yeow
collection USM
description Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the soldering conditions. These characteristics have posted a challenging task to develop an effective machine vision with acceptable level of classification accuracy. This research aims to investigate a new methodology of inspecting solder joint through analysis of the combined image from two viewing directions; one from orthogonal view while the other from oblique view. The concept based on the physics of surface tension, contact angle and slant angle of solder joint fillet.
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spelling usm.eprints-423922019-04-12T05:26:59Z http://eprints.usm.my/42392/ Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views Ong , Teng Yeow TJ1-1570 Mechanical engineering and machinery Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the soldering conditions. These characteristics have posted a challenging task to develop an effective machine vision with acceptable level of classification accuracy. This research aims to investigate a new methodology of inspecting solder joint through analysis of the combined image from two viewing directions; one from orthogonal view while the other from oblique view. The concept based on the physics of surface tension, contact angle and slant angle of solder joint fillet. 2010 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/42392/1/Ong_Teng_Yeow24.pdf Ong , Teng Yeow (2010) Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views. PhD thesis, Universiti Sains Malaysia.
spellingShingle TJ1-1570 Mechanical engineering and machinery
Ong , Teng Yeow
Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
title Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
title_full Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
title_fullStr Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
title_full_unstemmed Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
title_short Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
title_sort application of machine vision on solder joint inspection using orthogonal and oblique views
topic TJ1-1570 Mechanical engineering and machinery
url http://eprints.usm.my/42392/1/Ong_Teng_Yeow24.pdf
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