Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
The advance composite encapsulant with reinforce filler particle in the epoxy resin is a revolutionary advancement in the effort to improve the reliability of the electronic device. Many researches have been shown that by increase the amount of the filler particles in the composite encapsulant, th...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54245/1/Effect%20Of%20Thermal%20Energy%20On%20The%20Filling%20Time%20Of%20Composite%20Encapsulant%20Underfilling%20Process%20With%20Various%20Filler%20Loading%20Of%20Nano%20Silica%20Filler%20Particles_Amru%20Zulkurnain_M4_2018.pdf |