Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
Most of the devices nowadays contained electronic parts and often operated in vibration environment for extended periods without failing. The role of solder in electronic packages has expanded and act as electrical interconnection as well as mechanical bond to certain parts while the joint decreas...
Main Author: | Ilias, Muhammad Ikmal |
---|---|
Format: | Monograph |
Language: | English |
Published: |
Universiti Sains Malaysia
2018
|
Subjects: | |
Online Access: | http://eprints.usm.my/54367/1/Structural%20And%20Reliability%20Analysis%20Of%20Solder%20Joint%20Under%20Vibration%20Loading_Muhammad%20Ikmal%20Ilias_M4_2018.pdf |
Similar Items
-
Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
by: Chek, Muhammad Asyraf Wan
Published: (2019) -
Structural Analysis Of Stretchable Electronics Joint Under Tensile And Vibration Loading
by: Mustaffa, Nadirah
Published: (2017) -
Vibration and thermal cycling effects on solder joint reliability
by: Selvanathen, Daryl
Published: (2014) -
A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
by: Hardinnawirda, Kahar, et al.
Published: (2017) -
Solder joint fatigue in a surface mount assembly subjected to mechanical loading
by: Tamin, M. N., et al.
Published: (2007)