| Summary: | Electroless nickel (EN) plating is an attractive metallization technique for electronic components due to its properties such as uniform coating thickness, lower surface roughness and good thermal stability. Nanocomposites have provided
multifunctionality and additional strengthening effects in the nickel-phosphorus (Ni-P) matrix. However, agglomeration of nanoparticles in the plating solution has become a
main challenge in EN composite plating. In this study, 30 mg/L of 10 nm silver nanoparticles (AgNPs) was added into EN plating solution to produce nickel-phosphorus-silver (NiP/Ag) nanocomposite under the assistant of magnetic stirring at different stirring rate (0, 100, 200, 300, 400, and 500 rpm) with target to improve electrical contact of NiP
surface and wettability of solder reflow. Various characterization methods were used to characterize NiP/Ag nanocomposite such as X-ray diffraction (XRD), atomic force
microscopy (AFM), scanning electron microscopy (SEM), Ossila contact angle goniometer and contact resistance test. In XRD analysis, NiP/Ag nanocomposite has sharper peak compared to NiP coating and 500 rpm of NiP/Ag has the sharpest peak at
plane (111). Next, the results showed that the suitable magnetic stirring rate for NiP/Ag coatings in terms of thickness and wettability is at 100 rpm which give the thickest coating of 9.46 μm and lowest contact angle of 22.84o. However, 0 rpm is a suitable magnetic stirring rate to produce the lowest surface roughness of NiP/Ag nanocomposite with Ra
23.22 nm and lowest resistivity of 0.1133 Ω-cm.
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