Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite
Electroless nickel (EN) plating is an attractive metallization technique for electronic components due to its properties such as uniform coating thickness, lower surface roughness and good thermal stability. Nanocomposites have provided multifunctionality and additional strengthening effects in th...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2022
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| Online Access: | http://eprints.usm.my/56585/1/Effect%20Of%20Agitation%20To%20Electroless%20Nickel%20Plating%20Of%20NiP%20Ag%20Nanocomposite_Hor%20Bing%20Yao.pdf |
| _version_ | 1797013669009162240 |
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| author | Hor, Bing Yao |
| author_facet | Hor, Bing Yao |
| author_sort | Hor, Bing Yao |
| collection | USM |
| description | Electroless nickel (EN) plating is an attractive metallization technique for electronic components due to its properties such as uniform coating thickness, lower surface roughness and good thermal stability. Nanocomposites have provided
multifunctionality and additional strengthening effects in the nickel-phosphorus (Ni-P) matrix. However, agglomeration of nanoparticles in the plating solution has become a
main challenge in EN composite plating. In this study, 30 mg/L of 10 nm silver nanoparticles (AgNPs) was added into EN plating solution to produce nickel-phosphorus-silver (NiP/Ag) nanocomposite under the assistant of magnetic stirring at different stirring rate (0, 100, 200, 300, 400, and 500 rpm) with target to improve electrical contact of NiP
surface and wettability of solder reflow. Various characterization methods were used to characterize NiP/Ag nanocomposite such as X-ray diffraction (XRD), atomic force
microscopy (AFM), scanning electron microscopy (SEM), Ossila contact angle goniometer and contact resistance test. In XRD analysis, NiP/Ag nanocomposite has sharper peak compared to NiP coating and 500 rpm of NiP/Ag has the sharpest peak at
plane (111). Next, the results showed that the suitable magnetic stirring rate for NiP/Ag coatings in terms of thickness and wettability is at 100 rpm which give the thickest coating of 9.46 μm and lowest contact angle of 22.84o. However, 0 rpm is a suitable magnetic stirring rate to produce the lowest surface roughness of NiP/Ag nanocomposite with Ra
23.22 nm and lowest resistivity of 0.1133 Ω-cm. |
| first_indexed | 2024-03-06T16:05:28Z |
| format | Monograph |
| id | usm.eprints-56585 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2024-03-06T16:05:28Z |
| publishDate | 2022 |
| publisher | Universiti Sains Malaysia |
| record_format | dspace |
| spelling | usm.eprints-565852023-01-27T08:57:11Z http://eprints.usm.my/56585/ Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite Hor, Bing Yao T Technology TN Mining Engineering. Metallurgy Electroless nickel (EN) plating is an attractive metallization technique for electronic components due to its properties such as uniform coating thickness, lower surface roughness and good thermal stability. Nanocomposites have provided multifunctionality and additional strengthening effects in the nickel-phosphorus (Ni-P) matrix. However, agglomeration of nanoparticles in the plating solution has become a main challenge in EN composite plating. In this study, 30 mg/L of 10 nm silver nanoparticles (AgNPs) was added into EN plating solution to produce nickel-phosphorus-silver (NiP/Ag) nanocomposite under the assistant of magnetic stirring at different stirring rate (0, 100, 200, 300, 400, and 500 rpm) with target to improve electrical contact of NiP surface and wettability of solder reflow. Various characterization methods were used to characterize NiP/Ag nanocomposite such as X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), Ossila contact angle goniometer and contact resistance test. In XRD analysis, NiP/Ag nanocomposite has sharper peak compared to NiP coating and 500 rpm of NiP/Ag has the sharpest peak at plane (111). Next, the results showed that the suitable magnetic stirring rate for NiP/Ag coatings in terms of thickness and wettability is at 100 rpm which give the thickest coating of 9.46 μm and lowest contact angle of 22.84o. However, 0 rpm is a suitable magnetic stirring rate to produce the lowest surface roughness of NiP/Ag nanocomposite with Ra 23.22 nm and lowest resistivity of 0.1133 Ω-cm. Universiti Sains Malaysia 2022-08-13 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/56585/1/Effect%20Of%20Agitation%20To%20Electroless%20Nickel%20Plating%20Of%20NiP%20Ag%20Nanocomposite_Hor%20Bing%20Yao.pdf Hor, Bing Yao (2022) Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral. (Submitted) |
| spellingShingle | T Technology TN Mining Engineering. Metallurgy Hor, Bing Yao Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite |
| title | Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite |
| title_full | Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite |
| title_fullStr | Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite |
| title_full_unstemmed | Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite |
| title_short | Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite |
| title_sort | effect of agitation to electroless nickel plating of nip ag nanocomposite |
| topic | T Technology TN Mining Engineering. Metallurgy |
| url | http://eprints.usm.my/56585/1/Effect%20Of%20Agitation%20To%20Electroless%20Nickel%20Plating%20Of%20NiP%20Ag%20Nanocomposite_Hor%20Bing%20Yao.pdf |
| work_keys_str_mv | AT horbingyao effectofagitationtoelectrolessnickelplatingofnipagnanocomposite |