Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite
Electroless nickel (EN) plating is an attractive metallization technique for electronic components due to its properties such as uniform coating thickness, lower surface roughness and good thermal stability. Nanocomposites have provided multifunctionality and additional strengthening effects in th...
Main Author: | Hor, Bing Yao |
---|---|
Format: | Monograph |
Language: | English |
Published: |
Universiti Sains Malaysia
2022
|
Subjects: | |
Online Access: | http://eprints.usm.my/56585/1/Effect%20Of%20Agitation%20To%20Electroless%20Nickel%20Plating%20Of%20NiP%20Ag%20Nanocomposite_Hor%20Bing%20Yao.pdf |
Similar Items
-
Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012) -
Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
by: M.A., Rabiatul Adawiyah, et al.
Published: (2020) -
Corrosion Of Nanocomposite Sn/Ag Coating On Copper Substrate
by: Azmi, Nurul Atiqah
Published: (2022) -
Bioleaching of Nickel Ores
by: Pogaku Ravindra, et al.
Published: (2010) -
Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)