Mould Filling In Electronic Packaging
This final year project focuses on the study of flow in encapsulation processes of electronic packaging in an industry. The present study is using a program, which is written in Matlab language. Characteristic Based Split (CBS) method is utilized in this program to analyze and model the fluid...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2005
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| Online Access: | http://eprints.usm.my/58163/1/Mould%20Filling%20In%20Electronic%20Packaging_Heng%20Chai%20Wei.pdf |
| _version_ | 1797014006923264000 |
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| author | Heng, Chai Wei |
| author_facet | Heng, Chai Wei |
| author_sort | Heng, Chai Wei |
| collection | USM |
| description | This final year project focuses on the study of flow in encapsulation processes of electronic
packaging in an industry. The present study is using a program, which is written in Matlab
language. Characteristic Based Split (CBS) method is utilized in this program to analyze and
model the fluid flow in a single cavity mold of the encapsulation process. The velocity field
obtained from CBS method is thus used in pseudo-concentration algorithm, which uses the
VOF technique to track the fluid front for each time step. Finite element method (FEM) is
employed in all the analyses to reduce the governing partial differential equations to algebraic
equations. Parametric studies have been carried out to study how the dimensions and
parameters of the gate and die/chip affect the flow filling’s behavior. Parametric studies
showed by altering the dimensions of the mold tools, the filling time for certain cases would
be different due to different hydraulic resistances and pressure at the entrance of the mold
cavity. These parametric studies conducted for the purpose to achieve balanced mold filling in
the encapsulation process. |
| first_indexed | 2024-03-06T16:10:07Z |
| format | Monograph |
| id | usm.eprints-58163 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2024-03-06T16:10:07Z |
| publishDate | 2005 |
| publisher | Universiti Sains Malaysia |
| record_format | dspace |
| spelling | usm.eprints-581632023-04-20T04:53:29Z http://eprints.usm.my/58163/ Mould Filling In Electronic Packaging Heng, Chai Wei T Technology TJ Mechanical engineering and machinery This final year project focuses on the study of flow in encapsulation processes of electronic packaging in an industry. The present study is using a program, which is written in Matlab language. Characteristic Based Split (CBS) method is utilized in this program to analyze and model the fluid flow in a single cavity mold of the encapsulation process. The velocity field obtained from CBS method is thus used in pseudo-concentration algorithm, which uses the VOF technique to track the fluid front for each time step. Finite element method (FEM) is employed in all the analyses to reduce the governing partial differential equations to algebraic equations. Parametric studies have been carried out to study how the dimensions and parameters of the gate and die/chip affect the flow filling’s behavior. Parametric studies showed by altering the dimensions of the mold tools, the filling time for certain cases would be different due to different hydraulic resistances and pressure at the entrance of the mold cavity. These parametric studies conducted for the purpose to achieve balanced mold filling in the encapsulation process. Universiti Sains Malaysia 2005-03-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/58163/1/Mould%20Filling%20In%20Electronic%20Packaging_Heng%20Chai%20Wei.pdf Heng, Chai Wei (2005) Mould Filling In Electronic Packaging. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted) |
| spellingShingle | T Technology TJ Mechanical engineering and machinery Heng, Chai Wei Mould Filling In Electronic Packaging |
| title | Mould Filling In Electronic Packaging |
| title_full | Mould Filling In Electronic Packaging |
| title_fullStr | Mould Filling In Electronic Packaging |
| title_full_unstemmed | Mould Filling In Electronic Packaging |
| title_short | Mould Filling In Electronic Packaging |
| title_sort | mould filling in electronic packaging |
| topic | T Technology TJ Mechanical engineering and machinery |
| url | http://eprints.usm.my/58163/1/Mould%20Filling%20In%20Electronic%20Packaging_Heng%20Chai%20Wei.pdf |
| work_keys_str_mv | AT hengchaiwei mouldfillinginelectronicpackaging |