Mould Filling In Electronic Packaging
This final year project focuses on the study of flow in encapsulation processes of electronic packaging in an industry. The present study is using a program, which is written in Matlab language. Characteristic Based Split (CBS) method is utilized in this program to analyze and model the fluid...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2005
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| Online Access: | http://eprints.usm.my/58163/1/Mould%20Filling%20In%20Electronic%20Packaging_Heng%20Chai%20Wei.pdf |