Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out. Kajian tentang interaksi antara logam pateri tanpa plumbum dengan emas dan keliatan,kekuatan ricih yan...
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| Format: | Thesis |
| Language: | English |
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2004
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| Online Access: | http://eprints.usm.my/6264/1/EFFECT_OF_LEAD-FREE_SOLDER_AND_GOLD_CONTENT_ON_THE_SHEAR.pdf |
| _version_ | 1825827983651241984 |
|---|---|
| author | Oo, Cheng Ee |
| author_facet | Oo, Cheng Ee |
| author_sort | Oo, Cheng Ee |
| collection | USM |
| description | Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void
formation was carried out.
Kajian tentang interaksi antara logam pateri tanpa plumbum dengan emas dan keliatan,kekuatan ricih yang berkait rapat dengan pembentukan kompaun antaralogam dan lompong. |
| first_indexed | 2024-03-06T13:46:50Z |
| format | Thesis |
| id | usm.eprints-6264 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2024-03-06T13:46:50Z |
| publishDate | 2004 |
| record_format | dspace |
| spelling | usm.eprints-62642017-05-15T08:05:11Z http://eprints.usm.my/6264/ Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. Oo, Cheng Ee TN1-997 Mining engineering. Metallurgy Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out. Kajian tentang interaksi antara logam pateri tanpa plumbum dengan emas dan keliatan,kekuatan ricih yang berkait rapat dengan pembentukan kompaun antaralogam dan lompong. 2004-05 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/6264/1/EFFECT_OF_LEAD-FREE_SOLDER_AND_GOLD_CONTENT_ON_THE_SHEAR.pdf Oo, Cheng Ee (2004) Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. Masters thesis, Universiti Sains Malaysia. |
| spellingShingle | TN1-997 Mining engineering. Metallurgy Oo, Cheng Ee Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. |
| title | Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation
[TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. |
| title_full | Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation
[TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. |
| title_fullStr | Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation
[TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. |
| title_full_unstemmed | Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation
[TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. |
| title_short | Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation
[TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. |
| title_sort | effect of lead free solder and gold content on the shear strength toughness imc and void formation tt267 c518 2004 f rb kejuruteraan microfiche 7715 |
| topic | TN1-997 Mining engineering. Metallurgy |
| url | http://eprints.usm.my/6264/1/EFFECT_OF_LEAD-FREE_SOLDER_AND_GOLD_CONTENT_ON_THE_SHEAR.pdf |
| work_keys_str_mv | AT oochengee effectofleadfreesolderandgoldcontentontheshearstrengthtoughnessimcandvoidformationtt267c5182004frbkejuruteraanmicrofiche7715 |