Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards hi...
Main Author: | Munusamy, Sri Jaiandran |
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Format: | Thesis |
Language: | English |
Published: |
2006
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Subjects: | |
Online Access: | http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf |
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