Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application

The electrodeposition of copper onto carbon substrate was studied in 0.5 M of CuSO4 solution at various applied voltages; 2.0, 4.8 and 6.0 V. The electrodeposition was carried in an electrochemical cell with copper as the anode and carbon as the cathode. The influence of electrodeposition parameters...

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Main Authors: Sanat, Nurul Huda, Muhammad Nmaya, Muhammad, Yabagi, Jibrin Alhaji, Kimpa, Mohammed Isah, Agam, Mohd Arif
Format: Article
Language:English
Published: UTHM Publisher 2016
Subjects:
Online Access:http://eprints.uthm.edu.my/5503/1/AJ%202016%20%2889%29.pdf
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author Sanat, Nurul Huda
Muhammad Nmaya, Muhammad
Yabagi, Jibrin Alhaji
Kimpa, Mohammed Isah
Agam, Mohd Arif
author_facet Sanat, Nurul Huda
Muhammad Nmaya, Muhammad
Yabagi, Jibrin Alhaji
Kimpa, Mohammed Isah
Agam, Mohd Arif
author_sort Sanat, Nurul Huda
collection UTHM
description The electrodeposition of copper onto carbon substrate was studied in 0.5 M of CuSO4 solution at various applied voltages; 2.0, 4.8 and 6.0 V. The electrodeposition was carried in an electrochemical cell with copper as the anode and carbon as the cathode. The influence of electrodeposition parameters on the thickness of deposits and surface roughness of copper films were studied in detail using Atomic Force Microscopy (AFM). The current value increases with the increasing of applied voltage. Charge-discharge test was performed in 0.5 M and 1.0 M of HCl, and revealed that high concentration of electrolyte resulted high surface roughness and thickness of copper film.
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spelling uthm.eprints-55032022-01-13T01:40:47Z http://eprints.uthm.edu.my/5503/ Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application Sanat, Nurul Huda Muhammad Nmaya, Muhammad Yabagi, Jibrin Alhaji Kimpa, Mohammed Isah Agam, Mohd Arif TS200-770 Metal manufactures. Metalworking The electrodeposition of copper onto carbon substrate was studied in 0.5 M of CuSO4 solution at various applied voltages; 2.0, 4.8 and 6.0 V. The electrodeposition was carried in an electrochemical cell with copper as the anode and carbon as the cathode. The influence of electrodeposition parameters on the thickness of deposits and surface roughness of copper films were studied in detail using Atomic Force Microscopy (AFM). The current value increases with the increasing of applied voltage. Charge-discharge test was performed in 0.5 M and 1.0 M of HCl, and revealed that high concentration of electrolyte resulted high surface roughness and thickness of copper film. UTHM Publisher 2016 Article PeerReviewed text en http://eprints.uthm.edu.my/5503/1/AJ%202016%20%2889%29.pdf Sanat, Nurul Huda and Muhammad Nmaya, Muhammad and Yabagi, Jibrin Alhaji and Kimpa, Mohammed Isah and Agam, Mohd Arif (2016) Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application. Journal of Science and Technology, 8 (1). pp. 13-16. ISSN 2229-8460
spellingShingle TS200-770 Metal manufactures. Metalworking
Sanat, Nurul Huda
Muhammad Nmaya, Muhammad
Yabagi, Jibrin Alhaji
Kimpa, Mohammed Isah
Agam, Mohd Arif
Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application
title Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application
title_full Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application
title_fullStr Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application
title_full_unstemmed Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application
title_short Study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application
title_sort study of thin film copper electrodeposition on carbon substrate for thin film battery electrode application
topic TS200-770 Metal manufactures. Metalworking
url http://eprints.uthm.edu.my/5503/1/AJ%202016%20%2889%29.pdf
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