Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
The growth of intermetallic compounds (IMCs) of the tin-silver-copper-nickel/electroless nickel immersion silver (SACN/ENImAg) at the 230 °C during multiple reflows was investigated. The characterization analysis of the samples was conducted using scanning electron microscopy and assisted by a dispe...
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| Format: | Article |
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Wiley-VCH Verlag
2020
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