A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials
Demand for more interconnection joints between semiconductor devices can be realized with solder bump technology. Surface tension and density are usually material properties related factors that affect solder bump geometric shape. Therefore, to cope with this fast-changing microarchitecture design i...
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| Format: | Article |
| Language: | English |
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Ain Shams University
2022
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| Online Access: | http://eprints.utm.my/100758/1/MuhamadNoorHarun2022_AStudyofMicroScaleSolderBumpGeometricShapes.pdf |
| _version_ | 1796866943293063168 |
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| author | Mohd. Yusof, Ab. Aziz Mohd. Szali Januddi, Mohd. Al Fatihhi Harun, Muhamad Noor |
| author_facet | Mohd. Yusof, Ab. Aziz Mohd. Szali Januddi, Mohd. Al Fatihhi Harun, Muhamad Noor |
| author_sort | Mohd. Yusof, Ab. Aziz |
| collection | ePrints |
| description | Demand for more interconnection joints between semiconductor devices can be realized with solder bump technology. Surface tension and density are usually material properties related factors that affect solder bump geometric shape. Therefore, to cope with this fast-changing microarchitecture design in semiconductor technology, a better understanding of the solder bump geometric shape is needed. This study used a static equilibrium force approach to integrate the surface tension and gravitational energy into the solder energy content. Surface Evolver software was used to perform calculations and deliver the final solder bump shape. Perfect agreement with less than 10 % comparison between previous studies and the current Surface Evolver results was found. According to statistical analysis using SPSS, the maximum width of solder shape is closely related to the surface tension. In contrast, the maximum standoff is highly correlated with the solder density. By changing the solder volume, the solder bump changes from standard flip-chip bump to Cu pillar bump with consistency in maximum width to maximum standoff height ratio of 1.5. This study shows that the bumping technology can produce various sizes of solder bumps to meet new electronic packaging requirements. |
| first_indexed | 2024-03-05T21:19:45Z |
| format | Article |
| id | utm.eprints-100758 |
| institution | Universiti Teknologi Malaysia - ePrints |
| language | English |
| last_indexed | 2024-03-05T21:19:45Z |
| publishDate | 2022 |
| publisher | Ain Shams University |
| record_format | dspace |
| spelling | utm.eprints-1007582023-04-30T10:34:52Z http://eprints.utm.my/100758/ A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials Mohd. Yusof, Ab. Aziz Mohd. Szali Januddi, Mohd. Al Fatihhi Harun, Muhamad Noor TJ Mechanical engineering and machinery Demand for more interconnection joints between semiconductor devices can be realized with solder bump technology. Surface tension and density are usually material properties related factors that affect solder bump geometric shape. Therefore, to cope with this fast-changing microarchitecture design in semiconductor technology, a better understanding of the solder bump geometric shape is needed. This study used a static equilibrium force approach to integrate the surface tension and gravitational energy into the solder energy content. Surface Evolver software was used to perform calculations and deliver the final solder bump shape. Perfect agreement with less than 10 % comparison between previous studies and the current Surface Evolver results was found. According to statistical analysis using SPSS, the maximum width of solder shape is closely related to the surface tension. In contrast, the maximum standoff is highly correlated with the solder density. By changing the solder volume, the solder bump changes from standard flip-chip bump to Cu pillar bump with consistency in maximum width to maximum standoff height ratio of 1.5. This study shows that the bumping technology can produce various sizes of solder bumps to meet new electronic packaging requirements. Ain Shams University 2022 Article PeerReviewed application/pdf en http://eprints.utm.my/100758/1/MuhamadNoorHarun2022_AStudyofMicroScaleSolderBumpGeometricShapes.pdf Mohd. Yusof, Ab. Aziz and Mohd. Szali Januddi, Mohd. Al Fatihhi and Harun, Muhamad Noor (2022) A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials. Ain Shams Engineering Journal, 13 (6). pp. 1-7. ISSN 2090-4479 http://dx.doi.org/10.1016/j.asej.2022.101769 DOI : 10.1016/j.asej.2022.101769 |
| spellingShingle | TJ Mechanical engineering and machinery Mohd. Yusof, Ab. Aziz Mohd. Szali Januddi, Mohd. Al Fatihhi Harun, Muhamad Noor A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials |
| title | A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials |
| title_full | A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials |
| title_fullStr | A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials |
| title_full_unstemmed | A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials |
| title_short | A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials |
| title_sort | study of micro scale solder bump geometric shapes using minimizing energy approach for different solder materials |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.utm.my/100758/1/MuhamadNoorHarun2022_AStudyofMicroScaleSolderBumpGeometricShapes.pdf |
| work_keys_str_mv | AT mohdyusofabaziz astudyofmicroscalesolderbumpgeometricshapesusingminimizingenergyapproachfordifferentsoldermaterials AT mohdszalijanuddimohdalfatihhi astudyofmicroscalesolderbumpgeometricshapesusingminimizingenergyapproachfordifferentsoldermaterials AT harunmuhamadnoor astudyofmicroscalesolderbumpgeometricshapesusingminimizingenergyapproachfordifferentsoldermaterials AT mohdyusofabaziz studyofmicroscalesolderbumpgeometricshapesusingminimizingenergyapproachfordifferentsoldermaterials AT mohdszalijanuddimohdalfatihhi studyofmicroscalesolderbumpgeometricshapesusingminimizingenergyapproachfordifferentsoldermaterials AT harunmuhamadnoor studyofmicroscalesolderbumpgeometricshapesusingminimizingenergyapproachfordifferentsoldermaterials |