Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly
The lead-free Sn-0.4Ag-0.5Cu (SAC405) solder arrays provides an interconnection between the electronic package and printed circuit board (PCB) of the assembly. The ball grid array (BGA) test assembly was exposed to thermo-mechanical loading during solder reflow cooling and subsequent reliability tem...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
Universiti Malaysia Pahang Publishing
2022
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Subjects: | |
Online Access: | http://eprints.utm.my/103420/1/MohdNasirTamin2022_MechanicsofSolderIMCInterface.pdf |