3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
The continuous scaling of silicon technology has enabled many-core systems to become ubiquitous, offering enormous computational power for various applications spanning from high-performance computing to mobile devices. However, this advancement resulted in increased power density that exacerbated t...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/104907/1/MohammedSultanMohammed2023_3DDNaPEDynamicNeighborAwarePerformanceEnhancement.pdf |