Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader
This article investigates the thickness-dependent heat spreading performance of multilayer hexagonal boron nitride (hBN). The growth by a cold-wall chemical vapor deposition system results in large-area and high crystal quality of multilayer hBN. The full width at half maximum of Raman E2g peak is a...
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| Format: | Article |
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Elsevier Ltd
2023
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| _version_ | 1811132165510922240 |
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| author | Bulya Nazim, Nur Julia Nazim Abdullah, Mohd. Faizol Mat Hussin, Mohd. Rofei Mohamad Badaruddin, Siti Aishah Hashim, Abdul Manaf |
| author_facet | Bulya Nazim, Nur Julia Nazim Abdullah, Mohd. Faizol Mat Hussin, Mohd. Rofei Mohamad Badaruddin, Siti Aishah Hashim, Abdul Manaf |
| author_sort | Bulya Nazim, Nur Julia Nazim |
| collection | ePrints |
| description | This article investigates the thickness-dependent heat spreading performance of multilayer hexagonal boron nitride (hBN). The growth by a cold-wall chemical vapor deposition system results in large-area and high crystal quality of multilayer hBN. The full width at half maximum of Raman E2g peak is approximately 25 cm−1 and the bandgap is larger than 5.8 eV. Varying the growth duration from 5 to 15 min on Ni foil results in hBN thicknesses of 5–12 nm with comparable crystal quality. The electrothermal analysis using a sensitive Pt/Cu/Ti micro-coil introduces the figure of merit (FoM) of hBN as an insulator heat spreader. Fittings on FoM plots suggest that multilayer hBN with a thickness of ∼2 nm is optimum for a 25% reduction in the thermal hotspot. The initial drop in lateral thermal resistance is significant for a few nanometers-thick hBN, where a 22.5% reduction is measured from the 5.6 nm-thick hBN heat spreader. Further thickening of hBN reduces the lateral thermal resistance by approximately 0.37% nm−1. Findings from this work provide a significant contribution to the implementation of hBN as a direct contact heat spreader on the actual power devices. |
| first_indexed | 2024-09-23T23:58:32Z |
| format | Article |
| id | utm.eprints-105597 |
| institution | Universiti Teknologi Malaysia - ePrints |
| last_indexed | 2024-09-23T23:58:32Z |
| publishDate | 2023 |
| publisher | Elsevier Ltd |
| record_format | dspace |
| spelling | utm.eprints-1055972024-05-05T06:44:59Z http://eprints.utm.my/105597/ Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader Bulya Nazim, Nur Julia Nazim Abdullah, Mohd. Faizol Mat Hussin, Mohd. Rofei Mohamad Badaruddin, Siti Aishah Hashim, Abdul Manaf TK Electrical engineering. Electronics Nuclear engineering This article investigates the thickness-dependent heat spreading performance of multilayer hexagonal boron nitride (hBN). The growth by a cold-wall chemical vapor deposition system results in large-area and high crystal quality of multilayer hBN. The full width at half maximum of Raman E2g peak is approximately 25 cm−1 and the bandgap is larger than 5.8 eV. Varying the growth duration from 5 to 15 min on Ni foil results in hBN thicknesses of 5–12 nm with comparable crystal quality. The electrothermal analysis using a sensitive Pt/Cu/Ti micro-coil introduces the figure of merit (FoM) of hBN as an insulator heat spreader. Fittings on FoM plots suggest that multilayer hBN with a thickness of ∼2 nm is optimum for a 25% reduction in the thermal hotspot. The initial drop in lateral thermal resistance is significant for a few nanometers-thick hBN, where a 22.5% reduction is measured from the 5.6 nm-thick hBN heat spreader. Further thickening of hBN reduces the lateral thermal resistance by approximately 0.37% nm−1. Findings from this work provide a significant contribution to the implementation of hBN as a direct contact heat spreader on the actual power devices. Elsevier Ltd 2023-05 Article PeerReviewed Bulya Nazim, Nur Julia Nazim and Abdullah, Mohd. Faizol and Mat Hussin, Mohd. Rofei and Mohamad Badaruddin, Siti Aishah and Hashim, Abdul Manaf (2023) Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader. Materials Science in Semiconductor Processing, 158 (NA). NA. ISSN 1369-8001 http://dx.doi.org/10.1016/j.mssp.2023.107356 DOI:10.1016/j.mssp.2023.107356 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Bulya Nazim, Nur Julia Nazim Abdullah, Mohd. Faizol Mat Hussin, Mohd. Rofei Mohamad Badaruddin, Siti Aishah Hashim, Abdul Manaf Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader |
| title | Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader |
| title_full | Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader |
| title_fullStr | Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader |
| title_full_unstemmed | Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader |
| title_short | Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader |
| title_sort | maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hbn heat spreader |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
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