$Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects$

Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects

Bibliographic Details
Main Authors:	Kamsah, Mohd. Nasir, Tamin, Nazri
Format:	Book Section
Published:	Penerbit UTM 2007
Subjects:	TJ Mechanical engineering and machinery

Description
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