Image analysis on wire bonding
A software was created to calculate the intermetallic area in the MATLAB software environment. The software able to give an exact percentage of the intermetallic area using 2 methods that is %1M - based on normal-normal mixture modeling and gammagamma mixture modeling. The software also gives a comp...
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| Format: | Monograph |
| Language: | English |
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Universiti Teknologi Malaysia
2005
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| Online Access: | http://eprints.utm.my/2968/1/71857.pdf |
| _version_ | 1825909320853749760 |
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| author | Mohd. Noor, Norliza |
| author_facet | Mohd. Noor, Norliza |
| author_sort | Mohd. Noor, Norliza |
| collection | ePrints |
| description | A software was created to calculate the intermetallic area in the MATLAB software environment. The software able to give an exact percentage of the intermetallic area using 2 methods that is %1M - based on normal-normal mixture modeling and gammagamma mixture modeling. The software also gives a compactness number where a low value means good compact of the intermetallic area and high value means bad. Compactness will give user an indication on the quality of the wire bonding. |
| first_indexed | 2024-03-05T18:00:23Z |
| format | Monograph |
| id | utm.eprints-2968 |
| institution | Universiti Teknologi Malaysia - ePrints |
| language | English |
| last_indexed | 2024-03-05T18:00:23Z |
| publishDate | 2005 |
| publisher | Universiti Teknologi Malaysia |
| record_format | dspace |
| spelling | utm.eprints-29682017-07-31T03:48:48Z http://eprints.utm.my/2968/ Image analysis on wire bonding Mohd. Noor, Norliza TK Electrical engineering. Electronics Nuclear engineering A software was created to calculate the intermetallic area in the MATLAB software environment. The software able to give an exact percentage of the intermetallic area using 2 methods that is %1M - based on normal-normal mixture modeling and gammagamma mixture modeling. The software also gives a compactness number where a low value means good compact of the intermetallic area and high value means bad. Compactness will give user an indication on the quality of the wire bonding. Universiti Teknologi Malaysia 2005 Monograph NonPeerReviewed application/pdf en http://eprints.utm.my/2968/1/71857.pdf Mohd. Noor, Norliza (2005) Image analysis on wire bonding. Project Report. Universiti Teknologi Malaysia, Kuala Lumpur. (Unpublished) 71857 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Mohd. Noor, Norliza Image analysis on wire bonding |
| title | Image analysis on wire bonding |
| title_full | Image analysis on wire bonding |
| title_fullStr | Image analysis on wire bonding |
| title_full_unstemmed | Image analysis on wire bonding |
| title_short | Image analysis on wire bonding |
| title_sort | image analysis on wire bonding |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://eprints.utm.my/2968/1/71857.pdf |
| work_keys_str_mv | AT mohdnoornorliza imageanalysisonwirebonding |