Modular architecture of a non-contact pinch actuation micropump

This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental...

Full description

Bibliographic Details
Main Authors: Pei, Song Chee, Arsat, Rashidah, Adam, Tijjani, Hashim, Uda, Abdul Rahim, Ruzairi, Pei, Leow Ling
Format: Article
Language:English
Published: Multidisciplinary Digital Publishing Institute (MPDI) 2012
Subjects:
Online Access:http://eprints.utm.my/32925/1/RashidahArsat2012_ModularArchitectureofaNon-Contact.pdf
_version_ 1796857086080974848
author Pei, Song Chee
Arsat, Rashidah
Adam, Tijjani
Hashim, Uda
Abdul Rahim, Ruzairi
Pei, Leow Ling
author_facet Pei, Song Chee
Arsat, Rashidah
Adam, Tijjani
Hashim, Uda
Abdul Rahim, Ruzairi
Pei, Leow Ling
author_sort Pei, Song Chee
collection ePrints
description This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. © 2012 by the authors; licensee MDPI, Basel, Switzerland.
first_indexed 2024-03-05T18:52:31Z
format Article
id utm.eprints-32925
institution Universiti Teknologi Malaysia - ePrints
language English
last_indexed 2024-03-05T18:52:31Z
publishDate 2012
publisher Multidisciplinary Digital Publishing Institute (MPDI)
record_format dspace
spelling utm.eprints-329252018-11-30T06:33:29Z http://eprints.utm.my/32925/ Modular architecture of a non-contact pinch actuation micropump Pei, Song Chee Arsat, Rashidah Adam, Tijjani Hashim, Uda Abdul Rahim, Ruzairi Pei, Leow Ling TK Electrical engineering. Electronics Nuclear engineering This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. © 2012 by the authors; licensee MDPI, Basel, Switzerland. Multidisciplinary Digital Publishing Institute (MPDI) 2012-09 Article PeerReviewed application/pdf en http://eprints.utm.my/32925/1/RashidahArsat2012_ModularArchitectureofaNon-Contact.pdf Pei, Song Chee and Arsat, Rashidah and Adam, Tijjani and Hashim, Uda and Abdul Rahim, Ruzairi and Pei, Leow Ling (2012) Modular architecture of a non-contact pinch actuation micropump. Sensors, 12 (9). pp. 12572-12587. ISSN 1424-8220 http://dx.doi.org/10.3390/s120912572 DOI:10.3390/s120912572
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Pei, Song Chee
Arsat, Rashidah
Adam, Tijjani
Hashim, Uda
Abdul Rahim, Ruzairi
Pei, Leow Ling
Modular architecture of a non-contact pinch actuation micropump
title Modular architecture of a non-contact pinch actuation micropump
title_full Modular architecture of a non-contact pinch actuation micropump
title_fullStr Modular architecture of a non-contact pinch actuation micropump
title_full_unstemmed Modular architecture of a non-contact pinch actuation micropump
title_short Modular architecture of a non-contact pinch actuation micropump
title_sort modular architecture of a non contact pinch actuation micropump
topic TK Electrical engineering. Electronics Nuclear engineering
url http://eprints.utm.my/32925/1/RashidahArsat2012_ModularArchitectureofaNon-Contact.pdf
work_keys_str_mv AT peisongchee modulararchitectureofanoncontactpinchactuationmicropump
AT arsatrashidah modulararchitectureofanoncontactpinchactuationmicropump
AT adamtijjani modulararchitectureofanoncontactpinchactuationmicropump
AT hashimuda modulararchitectureofanoncontactpinchactuationmicropump
AT abdulrahimruzairi modulararchitectureofanoncontactpinchactuationmicropump
AT peileowling modulararchitectureofanoncontactpinchactuationmicropump