Modular architecture of a non-contact pinch actuation micropump
This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental...
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Format: | Article |
Language: | English |
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Multidisciplinary Digital Publishing Institute (MPDI)
2012
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Online Access: | http://eprints.utm.my/32925/1/RashidahArsat2012_ModularArchitectureofaNon-Contact.pdf |
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author | Pei, Song Chee Arsat, Rashidah Adam, Tijjani Hashim, Uda Abdul Rahim, Ruzairi Pei, Leow Ling |
author_facet | Pei, Song Chee Arsat, Rashidah Adam, Tijjani Hashim, Uda Abdul Rahim, Ruzairi Pei, Leow Ling |
author_sort | Pei, Song Chee |
collection | ePrints |
description | This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. © 2012 by the authors; licensee MDPI, Basel, Switzerland. |
first_indexed | 2024-03-05T18:52:31Z |
format | Article |
id | utm.eprints-32925 |
institution | Universiti Teknologi Malaysia - ePrints |
language | English |
last_indexed | 2024-03-05T18:52:31Z |
publishDate | 2012 |
publisher | Multidisciplinary Digital Publishing Institute (MPDI) |
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spelling | utm.eprints-329252018-11-30T06:33:29Z http://eprints.utm.my/32925/ Modular architecture of a non-contact pinch actuation micropump Pei, Song Chee Arsat, Rashidah Adam, Tijjani Hashim, Uda Abdul Rahim, Ruzairi Pei, Leow Ling TK Electrical engineering. Electronics Nuclear engineering This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. © 2012 by the authors; licensee MDPI, Basel, Switzerland. Multidisciplinary Digital Publishing Institute (MPDI) 2012-09 Article PeerReviewed application/pdf en http://eprints.utm.my/32925/1/RashidahArsat2012_ModularArchitectureofaNon-Contact.pdf Pei, Song Chee and Arsat, Rashidah and Adam, Tijjani and Hashim, Uda and Abdul Rahim, Ruzairi and Pei, Leow Ling (2012) Modular architecture of a non-contact pinch actuation micropump. Sensors, 12 (9). pp. 12572-12587. ISSN 1424-8220 http://dx.doi.org/10.3390/s120912572 DOI:10.3390/s120912572 |
spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Pei, Song Chee Arsat, Rashidah Adam, Tijjani Hashim, Uda Abdul Rahim, Ruzairi Pei, Leow Ling Modular architecture of a non-contact pinch actuation micropump |
title | Modular architecture of a non-contact pinch actuation micropump |
title_full | Modular architecture of a non-contact pinch actuation micropump |
title_fullStr | Modular architecture of a non-contact pinch actuation micropump |
title_full_unstemmed | Modular architecture of a non-contact pinch actuation micropump |
title_short | Modular architecture of a non-contact pinch actuation micropump |
title_sort | modular architecture of a non contact pinch actuation micropump |
topic | TK Electrical engineering. Electronics Nuclear engineering |
url | http://eprints.utm.my/32925/1/RashidahArsat2012_ModularArchitectureofaNon-Contact.pdf |
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