Damage mechanics model for solder/intermetallic interface fracture process in solder joint
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fractu...
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| Format: | Article |
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Scientific.Net
2011
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