Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element method. The model consists of 92 solder joints arran...
Main Authors: | , |
---|---|
Format: | Article |
Language: | English |
Published: |
Universiti Kebangsaan Malaysia
2005
|
Subjects: | |
Online Access: | http://eprints.utm.my/470/1/cem05-039_MNTamin__Ed_3.pdf |