Nanoscale microstructural characterization of aluminum and copper bilayer thin films deposited on silicon substrate using magnetron sputtering technique
Aluminum and copper (Al-Cu) bilayer thin films are commonly used as conductors in electronic applications. Unfortunately, the effect of thermal aging on the interfaces of Al-Cu bilayer thin films have led to the formation of intermetallic compounds (IMCs) which eventually degrades the materials. The...
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| Format: | Thesis |
| Language: | English |
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2014
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| Online Access: | http://eprints.utm.my/50821/25/ZulhelmiAlifAbdulHalimMFKM2014.pdf |