Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers
The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed in-situ in a scanning electron microscop...
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| Format: | Article |
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Trans Tech Publications Ltd.
2015
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| _version_ | 1796860673706164224 |
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| author | Kuwano, N. Horikami, S. Linas, M. |
| author_facet | Kuwano, N. Horikami, S. Linas, M. |
| author_sort | Kuwano, N. |
| collection | ePrints |
| description | The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed in-situ in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers. |
| first_indexed | 2024-03-05T19:44:49Z |
| format | Article |
| id | utm.eprints-59248 |
| institution | Universiti Teknologi Malaysia - ePrints |
| last_indexed | 2024-03-05T19:44:49Z |
| publishDate | 2015 |
| publisher | Trans Tech Publications Ltd. |
| record_format | dspace |
| spelling | utm.eprints-592482021-08-19T03:21:14Z http://eprints.utm.my/59248/ Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers Kuwano, N. Horikami, S. Linas, M. T Technology (General) The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed in-situ in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers. Trans Tech Publications Ltd. 2015 Article PeerReviewed Kuwano, N. and Horikami, S. and Linas, M. (2015) Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers. Materials Science Forum, 827 . pp. 341-346. ISSN 0255-5476 http://www.dx.doi.org/10.4028/www.scientific.net/MSF.827.341 DOI: 10.4028/www.scientific.net/MSF.827.341 |
| spellingShingle | T Technology (General) Kuwano, N. Horikami, S. Linas, M. Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers |
| title | Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers |
| title_full | Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers |
| title_fullStr | Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers |
| title_full_unstemmed | Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers |
| title_short | Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers |
| title_sort | electron microscopy study of grain boundary behavior in pb free solder materials for mitigation of whiskers |
| topic | T Technology (General) |
| work_keys_str_mv | AT kuwanon electronmicroscopystudyofgrainboundarybehaviorinpbfreesoldermaterialsformitigationofwhiskers AT horikamis electronmicroscopystudyofgrainboundarybehaviorinpbfreesoldermaterialsformitigationofwhiskers AT linasm electronmicroscopystudyofgrainboundarybehaviorinpbfreesoldermaterialsformitigationofwhiskers |