Non-Fickian moisture uptake characterisation of epoxy-based moulding compounds with thickness effect

The present work focuses on characterising the moisture uptake behaviour in epoxy-based moulding compounds (EMCs) commonly employed in electronics assembly. Available experimental results on selected EMCs with two different thicknesses of 1.4 mm and 3.0 mm and aged at 60°C/85%RH and 85°C/85%RH are c...

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Bibliographic Details
Main Authors: Wong, K. J., Tamin, M. N.
Format: Conference or Workshop Item
Published: 2015
Subjects:

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