Thermomigration induced degradation in solder alloys
Miniaturization of electronics to the nanoscale brings new challenges. Because of their small size and immense information and power processing capacity, large temperature gradients exist across nanoelectronics and power electronics solder joints. In this paper, a fully coupled thermomechanical-diff...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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State University of New York at Buffalo, USA
2008
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| Online Access: | http://eprints.utm.my/8489/3/CemalBasaran2008_ThermomigrationInducedDegradationInSolder.pdf |
| _version_ | 1825910204967944192 |
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| author | Basaran, C. Li, S. Abdul Hamid, M. F. |
| author_facet | Basaran, C. Li, S. Abdul Hamid, M. F. |
| author_sort | Basaran, C. |
| collection | ePrints |
| description | Miniaturization of electronics to the nanoscale brings new challenges. Because of their small size and immense information and power processing capacity, large temperature gradients exist across nanoelectronics and power electronics solder joints. In this paper, a fully coupled thermomechanical-diffusion model is introduced to study the thermomigration induced strength degradation. A nonlinear viscoplastic material model with kinematic and isotropic hardening features is utilized. The model takes into account microstructural evolution of the material. A grain coarsening capability is built into the model to study its influence on thermomigration in solder alloys. The model is validated by comparing the simulation results with experimental data. |
| first_indexed | 2024-03-05T18:13:36Z |
| format | Article |
| id | utm.eprints-8489 |
| institution | Universiti Teknologi Malaysia - ePrints |
| language | English |
| last_indexed | 2024-03-05T18:13:36Z |
| publishDate | 2008 |
| publisher | State University of New York at Buffalo, USA |
| record_format | dspace |
| spelling | utm.eprints-84892017-10-19T00:03:52Z http://eprints.utm.my/8489/ Thermomigration induced degradation in solder alloys Basaran, C. Li, S. Abdul Hamid, M. F. TJ Mechanical engineering and machinery Miniaturization of electronics to the nanoscale brings new challenges. Because of their small size and immense information and power processing capacity, large temperature gradients exist across nanoelectronics and power electronics solder joints. In this paper, a fully coupled thermomechanical-diffusion model is introduced to study the thermomigration induced strength degradation. A nonlinear viscoplastic material model with kinematic and isotropic hardening features is utilized. The model takes into account microstructural evolution of the material. A grain coarsening capability is built into the model to study its influence on thermomigration in solder alloys. The model is validated by comparing the simulation results with experimental data. State University of New York at Buffalo, USA 2008-06-19 Article PeerReviewed application/pdf en http://eprints.utm.my/8489/3/CemalBasaran2008_ThermomigrationInducedDegradationInSolder.pdf Basaran, C. and Li, S. and Abdul Hamid, M. F. (2008) Thermomigration induced degradation in solder alloys. American Institute of Physics, 103 (12). pp. 1-9. ISSN 1070-664X http://dx.doi.org/10.1063/1.2943261 10.1063/1.2943261 |
| spellingShingle | TJ Mechanical engineering and machinery Basaran, C. Li, S. Abdul Hamid, M. F. Thermomigration induced degradation in solder alloys |
| title | Thermomigration induced degradation in solder alloys |
| title_full | Thermomigration induced degradation in solder alloys |
| title_fullStr | Thermomigration induced degradation in solder alloys |
| title_full_unstemmed | Thermomigration induced degradation in solder alloys |
| title_short | Thermomigration induced degradation in solder alloys |
| title_sort | thermomigration induced degradation in solder alloys |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.utm.my/8489/3/CemalBasaran2008_ThermomigrationInducedDegradationInSolder.pdf |
| work_keys_str_mv | AT basaranc thermomigrationinduceddegradationinsolderalloys AT lis thermomigrationinduceddegradationinsolderalloys AT abdulhamidmf thermomigrationinduceddegradationinsolderalloys |